film thickness, metrology, measurement, instrument, thin film, thick film, wafer thinning, backgrind, refractive index, ellipsometry, interferometry, reflectivity, spectrometer, oxide, photoresist, resist, uniformity, polymer, nitride, oxynitride, polyimide, BCB, SU-8, spin-on, low-k, a-silcon, polysilicon, amorphous silicon, dielectric, silicon, silicide, GaAs, mapping, wafer, semiconductor, plating, electroplating, advanced packaging, epitaxy, MEMS, magnetic disk, micromachining, flat panel display
  • Compact footprint with high reliability R – Θ stage
  • Generate thickness contour map in less than one minute
  • Internal reference – calibration standard to maintain accuracy
  • Produces no stray white light
  • Optical design eliminates need for focusing
  • Simple maintenance: semiannual lamp change done in minutes


  • Different thickness ranges
  • Monochrome camera system
  • Vacuum chuck
  • Manual positioning (KV-300m)
  • SEMI S2 compliant (option)