Patented, breakthrough technology!
This product optically measures the thickness of silicon or other materials using infrared light.
This tool can help solve your backthinned wafer yield problems or enable reduced thicknesses.
- Materials: Si, GaAs, InP, quartz, resist, …
- Measure bumped wafers
- Measure through tape on top or bottom
- Allows conductive substrates
- 300 mm vacuum chuck
- Also available as manual positioning or as an integrated metrology tool
Thickness measurement range:
Short-term repeatability: 1
Measurement spot size:
4-400 µm (config “A”)
200 nm typical
2 s per location
> 100 km of travel