film thickness, metrology, measurement, instrument, thin film, thick film, wafer thinning, backgrind, refractive index, ellipsometry, interferometry, reflectivity, spectrometer, oxide, photoresist, resist, uniformity, polymer, nitride, oxynitride, polyimide, BCB, SU-8, spin-on, low-k, a-silcon, polysilicon, amorphous silicon, dielectric, silicon, silicide, GaAs, mapping, wafer, semiconductor, plating, electroplating, advanced packaging, epitaxy, MEMS, magnetic disk, micromachining, flat panel display

Patented, breakthrough technology!

This product optically measures the thickness of silicon or other materials using infrared light.
This tool can help solve your backthinned wafer yield problems or enable reduced thicknesses.

  • Materials: Si, GaAs, InP, quartz, resist, …
  • Measure bumped wafers
  • Measure through tape on top or bottom
  • Allows conductive substrates
  • 300 mm vacuum chuck
  • Also available as manual positioning or as an integrated metrology tool

Thickness measurement range:
Short-term repeatability: 1
Measurement spot size:
Measurement time:
Stage life:

4-400 µm (config “A”)
200 nm typical
25 µm
2 s per location
> 100 km of travel