N-2

Revive your old NanoSpec

The N-2 updates the Nanometrics (or any similar Olympus BHM Microscope) to a modern film thickness metrology system. We replace the top optics and spectrometer and add a Windows 10 PC with our software. Works on AFT, 181, 210, 2100, and 4000 products.

  • Reliable and simple to operate
  • Export or save data to your network
  • Included video system for position control
  • No stray white light produced
  • Extensive material library with ability to use Nano files
  • Semiannual lamp change done in minutes with no tools
film thickness, metrology, measurement, instrument, thin film, thick film, wafer thinning, backgrind, refractive index, ellipsometry, interferometry, reflectivity, spectrometer, oxide, photoresist, resist, uniformity, polymer, nitride, oxynitride, polyimide, BCB, SU-8, spin-on, low-k, a-silcon, polysilicon, amorphous silicon, dielectric, silicon, silicide, GaAs, mapping, wafer, semiconductor, plating, electroplating, advanced packaging, epitaxy, MEMS, magnetic disk, micromachining, flat panel display

Specs:

  • Standard thickness range: 30 nm – 25 µm (oxide) 1
  • Optional thickness range: 30 nm – 70 µm
  • Measurement spot size with 10x objective: 20 µm
  • Measure time: < 1 s

1 For repeatability < 1 nm; thinner measurements possible with greater repeatability

film thickness, metrology, measurement, instrument, thin film, thick film, wafer thinning, backgrind, refractive index, ellipsometry, interferometry, reflectivity, spectrometer, oxide, photoresist, resist, uniformity, polymer, nitride, oxynitride, polyimide, BCB, SU-8, spin-on, low-k, a-silcon, polysilicon, amorphous silicon, dielectric, silicon, silicide, GaAs, mapping, wafer, semiconductor, plating, electroplating, advanced packaging, epitaxy, MEMS, magnetic disk, micromachining, flat panel display